Thermal double-sided tape SY material properties of thermally conductive material [1] combines high thermal conductivity and insulation materials, use easy. To operate in inter-agency assembled the best of the material surface is not flat. 2 polymer used to make this product has excellent flexibility, obedient, self-adhesive and high compression ratio, especially self-adhesive part, make it easier to assemble the production line. 3 adapt the work environment temperature range, can effectively overcome the adverse institutional environment, can fill the uneven surface, heat and comprehensive export of electronic components, even in confined spaces there is no need to change any organization to use. 4 at the same time an effective solution to customers and other thermal insulation and cushioning questions about, and has passed inspection and control of a variety of harmful substances, customers in the application of electronic products the best choice. [Applications] 1. electronic components: IC, CPU, MOS. , M / B, PS, HEAT SINK, LCD-TV, NB, PC ...... etc Module, DVD Applicatins ...... and so on. Product Description: Material: None / Substrate thickness: 0.1mm / 0.15mm / 0.2mm / 0.3mm / 0.5mm color: white more arguments are welcome to inquire CPU thermal double-sided tape / conductive double-sided tape BOND-PLY. a thermally conductive double-sided pressure-sensitive adhesive tape, with good thermal insulating properties, it is made of coated PSA (pressure sensitive adhesive) on the glass fiber or film, good paste properties at high temperatures and the temperature operation, the long-term to maintain a high bond strength, can be removed, clip, screws, fixed except oranges. 1, bonding ASIC, graphics cards, CPU and cooling cards. 2, bonding flexible circuits and rigid thermally conductive plate. 3, in a variety of electronic products, bonding metal fins. 4, BGA thermal plate mounting tape. Thermal double-sided adhesive thermal tape thermal conductivity material Overview: KDCF300 series thermal double-sided pressure-sensitive adhesive tape is a high-performance filled by the high thermal conductivity of the ceramic particles made of glass fiber fabric coated on both sides with or without substrate. KDCF300 series of thermal double-sided tape between electronic devices and heat sinks provide efficient heat transfer path between the electronic device and the radiator so that it no longer needs the mechanical fastening and fixing liquid adhesive curing. Characteristics: KDCF300 series of thermal double-sided tape use only light pressure an immediate bonding; its adhesive properties, adhesive strength with time and temperature dependent manner. KDCF300 series thermal double-sided tape can be die-cut any shape and can be posted in advance for future use adhesive on one surface. Applications: KDCF300 series thermal double-sided adhesive tape applied to the chip, flexible circuit boards and high-power transistors and heat sinks or other cooling devices. Such as: high-power LED aluminum plate bonded with radiator heating installation resilient sheet installation temperature display film installation thermoelectric cooling radiator on the microprocessor die bonding flexible circuit and heat sink bonding power transistor and the printed circuit board stick Joint Technology parameters: Item Test Method Visual appearance vain white base without fiberglass cloth fiberglass cloth fiberglass cloth thickness mm 0.1 0.1 ASTM374 total thickness mm 0.05 0.15 0.2 ASTM374 thermal conductivity W / 0.8 0.8 0.8 ASTM D5470 Thermal impedance ℃ in2 / w 0.1 0.23 0.3 ASTM D5470 bond strength N / cm 4.1 5.3 6.5 ASTM D1002 breakdown voltage KVAC 1.0 2.5 3.0 ASTM D149 volume resistivity ohm / cm 3X1013 3X1013 3X1013 ASTM D257 Temperature range ℃ -20 ~ 130 -20 ~ 130 -20 ~ 130 storage period (months) 24 24 24 thermal double-sided tape, silicone thermal tape substrate thickness 0.05 / 0.1 / 0.2 / 0.3 / 0.5 (mm) width of any cut (mm) color white long-term temperature resistance 130 (℃) applicable The LED thermal heat dissipation, chips, and other short-term temperature thermal processing cry of 200 (℃) Adhesive Silicone following models, please purchase your requirements. The total thickness of 0.05mm thermally conductive substrate-free double-sided tape total thickness 0.10mm substrate-thermal double-sided tape, the total thickness of 0.15mm fiberglass cloth thermal double-sided tape, the total thickness of 0.20mm thermally conductive substrate-free double-sided tape, the total thickness of 0.25 mm thermally conductive substrate-free double-sided tape 730-25 overall thickness of 0.25mm fiberglass cloth thermal double-sided tape, the total thickness of 0.30mm fiberglass cloth thermal double-sided tape, the total thickness of 0.50mm fiberglass cloth thermal double-sided tape excellent thermal conductivity effect stable adhesion, weather resistance, high cost, LED Light Bar mechanism to resolve issues and facilitate assembly of heat conduction problems thermal tape tape thermal heat sink thermal double-sided tape on the back of the tape is widely used in CPU, power management, module thermal design power, or other heat conduction device, it can completely replace the traditional grease applications, convenient and efficient transfer of heat. Thermal tape with high thermal conductivity thermal rubber substrate, single or double-sided pressure-sensitive thermal adhesive backing, bonding reliability, high strength. Thermal tape thickness is small, flexible, and very easy to fit the device and the heat sink surface. Thermally conductive adhesive tape can also be adapted hot and cold temperature changes, to ensure consistent and stable performance. Thermal tape of high adhesive strength, excellent thermal conductivity can pressure-sensitive adhesive fixing device and the heat sink to achieve thermal insulation and fixed, especially suitable for high integration, small equipment space, and so difficult to fix, is to reduce Small heat annex occupied volume, optimized for materials design. Typical applications: heat sink to the plastic packaged device to a heat sink fins bonded to the circuit board fixed product features a metal or ceramic package devices: double-sided adhesive forms replace mechanical fixation. Polypropylene or silicone adhesive. Equipped with ceramic filler for low-impedance connection. Electrically insulating and non-electrical insulation varieties can provide. Thermal double-sided tape strong adhesive tape heatsink thermal double-sided stickers in IC, LED heat sink fixed area is the most effective method for double-sided adhesive professional fins and chips, LED easier to use, the LED between the heat and paste bondplys aluminum, with a little force by then; thermal effect is significant effect than the average of thermal plastic. The product can also be used for bonding other devices require thermal conductivity, replacing it with screws, you can achieve the most effective heat dissipation. 2. General bonding heat sinks and other heating equipment usage is very convenient, is placed between the thermal double-sided heating element and heat sink, forcing compression, namely fins secured to the heating element, easy to use Convenient, help to improve productivity. Its cooling effect than normal cooling effect is obvious stickers, greatly enhance the life of the device, some of the preferred high thermal conductivity and require electronic products. 3. High thermal conductivity and stable than thermal double-sided stickers long life under its normal temperature (80-120 degrees) can work a minimum 5-year 4. Specifications: 300MM * 1500MM; Thickness:. 0.05 ~ 3.0mm; can be cut cut to specifications. Application: other manufacturing industries electronic appliances, LED lighting, metal industry, printing industry and other basic specifications: 200mm * 400mm, 300mm * 1500mm; to follow specific size using standard cut. LED professional use thermally conductive material thermal double-sided tape thermal silica films, soft thermal silica films, soft silicone film, high thermal conductivity silicone gaskets, thermal phase change materials, thermal silicon (Si) film, thermal insulation silicone cloth, no fiber silicon tape, silicone caps, insulation Earthquake thermal insulation material, such as tablets. Main features: thermal insulation, self-adhesive, shock, filling. Model: KD-CF purposes: for the control board electrical and electronic products, TFT-LCD, notebook computers, power supply, LED lighting and other products, since the thermal conductivity, filling, damping effect; can be single-sided silicone cloth to enhance its mechanical properties, can be directly adhered to the surface of the body member without using screws and other reinforcement. (May die according to customer requirements into any shape sheet can also be affixed adhesive or gluing) Typical applications: Customers can choose the thickness of the thermal silica film suitable according to size of the gap between the heating element and heat sink, with the electronic products, intimate contact between electronic devices heat power devices (integrated circuits, power management, SCR, transformers, etc.) and cooling facilities (heat sink, aluminum, etc.), to achieve better thermal effects. Notes: 1, common colors: white, gray, black 2, common thickness: 0.5-12mm 3, Model KD-CF 4, colors and specifications can be produced upon request.